Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1979-12-18
1981-08-25
Lazarus, Richard B.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 40, 228 43, 228259, 228260, 198342, 134 83, B23K 108
Patent
active
042854571
ABSTRACT:
An apparatus for soldering printed circuit boards includes carriers each adapted for holding a printed circuit board and conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel is disposed between a pair of laterally spaced apart track members which are engageable two front and two rear wheels of the carrier to support the carrier and the printed circuit board generally in the horizontal state throughout the movement thereof along the track members. Each track member has a first and a second depression at such locations that the two front and the two rear wheels can simultaneously position in the first and second depressions, respectively. Each depression has a depth sufficient to permit the printed circuit board to be dipped into the molten solder when the four wheels travel therealong. A slide rail member engageable by the front and rear wheels is provided adjacent at least one of the track members and is displaced so as to prevent the front wheels and rear wheels from travelling along the second and first depressions, respectively.
REFERENCES:
patent: 3000342 (1961-09-01), Dorosz et al.
patent: 3828419 (1974-08-01), Wanner
Lazarus Richard B.
Yee Stephen F. K.
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