Fishing – trapping – and vermin destroying
Patent
1990-03-06
1992-01-21
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437195, 437197, 437199, H01L 2144
Patent
active
050828010
ABSTRACT:
The present invention is directed to a process for producing a semiconductor device that has a multilayer interconnection composed of a plurality of conductive layers electrically separated from each other by interlayer insulating layers inserted therebetween in an area other than the sites at which the conductive layers are electrically interconnected via a through hole. At least one of the conductive layers has a layer formed thereon for preventing stress- and/or electro-migration thereof. The process comprises the steps of forming a first conductive layer; forming on the first conductive layer a layer for preventing stress- and/or electro-migration of the conductive layer; forming an opening through the entire thickness of the migration-preventing layer that has a diameter less than the width of the conductive layer, so as to expose a surface of the conductive layer within the region surrounded by the periphery of the opening; forming an interlayer insulating layer on the migration-preventing layer and the exposed surface of the conductive layer so as to cover the migration-preventing layer and the underlying conductive layer and to fill the opening; forming a through hole having a diameter less than that of the opening and extending through the entire thickness of the interlayer insulating layer to the surface of the conductive layer within the region of the filled opening so that the surface of the conductive layer is exposed but the periphery of the opening is not exposed; and forming a second conductive layer on the interlayer insulating layer so that, during the forming of the second conductive layer, the through hole is filled with the conductive substance of said second conductive layer to thereby electrically connect the first and the second conductive layers.
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Chaudhuri Olik
Fourson G.
Fujitsu Limited
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