Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Patent
1998-05-14
2000-08-08
Potter, Roy
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
257700, 257697, H01L 2348
Patent
active
061005851
ABSTRACT:
A structure for mounting a device on a circuit board, comprising two relay substrates provided parallel to each other between the circuit board and the device, one of the relay substrates being constituted by a relay socket substrate with an array of socket pins being inserted into and supported by the relay socket substrate, each of the socket pins being soldered to a corresponding one of solder pads in the circuit board, the other relay substrate being constituted by a relay pin substrate with an array of relay pins, for connection to the device, being inserted into and supported by the relay pin substrate, each of the relay pins being soldered to a corresponding one of solder balls provided in the device, the relay pins, in the relay pin substrate, each in its one end opposite to the soldered end being detachably fitted in the socket pins each in its one end on the socket side. This construction enables repair and replacement of the device and the evaluation and tests of the performance of the device.
REFERENCES:
patent: 5481435 (1996-01-01), Werther
patent: 5561594 (1996-10-01), Wakefield
patent: 5825630 (1998-10-01), Taylor et al.
NEC Corporation
Potter Roy
LandOfFree
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