Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1999-02-24
2000-08-08
Williams, Alexander O.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257710, 257728, 257729, 257702, 257432, 257669, 257528, 257532, H01L 23053, H01L 2348, H01L 2312, H05K 720
Patent
active
061005835
ABSTRACT:
A semiconductor element such as a CCD chip is contained in a recess portion of an opaque package made of plastic, and the upper surface thereof is covered with a transparent cap made of plastic. The cap has a different thermal expansion coefficient from that of the package and is formed in a thickness of 0.5 mm which is thinner than that of the prior art. The semiconductor element is connected with leads and these leads project outside the package. This semiconductor device is mounted to a printed circuit board.
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NEC Corporation
Williams Alexander O.
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