Semiconductor device and method of producing the same

Details Semiconductor device and method of producing the same Semiconductor device and method of producing the same

1993-01-04

1995-03-21

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257687, 257700, 257787, 26427211, H01L 2302

Patent

active

053998049

ABSTRACT:
A semiconductor device includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two electrode members, a plurality of leads including inner leads which are wire bonded to at least one of the semiconductor chip and the electrode members and electrically connected thereto, and a resin package which encapsulates the semiconductor chip, the stage, the electrode members and the inner leads by a resin. The resin fills the first and second gaps, so that the stage and the one electrode member are isolated and the two electrode members are isolated.

REFERENCES:
patent: 4714952 (1987-12-01), Takekawa
patent: 5216280 (1993-06-01), Tanaka et al.
patent: 5218230 (1993-06-01), Tamamura et al.
patent: 5223739 (1993-06-01), Katsumata et al.
patent: 5225709 (1993-07-01), Nishiuma et al.

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