Heat-conductive adhesive films, laminates with heat-conductive a

Details Heat-conductive adhesive films, laminates with heat-conductive a Heat-conductive adhesive films, laminates with heat-conductive a

1993-11-30

1995-03-21

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 361712, 361736, B32B 900

Patent

active

053994167

ABSTRACT:
A laminate comprising (a) a carrier having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 .mu.m, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive filler and has a thickness of 5 to 500 .mu.m and a heat conductivity of 1 W/mK. The flexible laminate, or a dielectric and self-supporting adhesive film which contains a heat-conductive filler and has a heat conductivity of at least 1 W/mK, is suitable for removing heat from leadframes which have electrically insulated contact surfaces for electrical and electronic components and which are encapsulated with a synthetic resin moulding material, typically dual-in-line plastic packages, by bonding the rear sides of the contact surfaces to the leads.

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Chem. Abst. 87-343851/49 af FR 2597.261 (7/87).
Chem. Abst JP 59,175,753 (2/84).
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