Encapsulation of electronic components with poly(arylene sulfide

Details Encapsulation of electronic components with poly(arylene sulfide Encapsulation of electronic components with poly(arylene sulfide

1988-08-05

1991-02-19

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524423, 524451, 524609, 523213, C08K 336, C08K 340

Patent

active

049945149

ABSTRACT:
Electronic components can be encapsulated with a poly(arylene sulfide) composition containing a mercaptosilane such as, for example, 3-mercaptopropyltrimethoxysilane.

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