Semiautomatic solid chip removal apparatus

Details Semiautomatic solid chip removal apparatus Semiautomatic solid chip removal apparatus

1977-06-06

1979-01-30

Hall, Carl E.

Metal working

Means to assemble or disassemble

Means to disassemble electrical device

219230, 228 19, 228264, B23P 1900

Patent

active

041364449

ABSTRACT:
The present invention relates to portable, semiautomatic apparatus for aligning and removing solid state multicontact electrical circuit devices, e.g. DIP (dual-in-line package) chips from printed circuit panels or boards so as to prepare the board for new or replacement chip insertion and soldering.

REFERENCES:
patent: 3644980 (1972-02-01), Class, Jr.
patent: 3731866 (1973-05-01), Mason
patent: 4022370 (1977-05-01), Durney

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