Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1977-01-31
1979-01-30
Ozaki, G.
Metal working
Method of mechanical manufacture
Assembling or joining
148 15, 148 33, 148134, H01L 2118
Patent
active
041364350
ABSTRACT:
The ultra-miniaturized, active solid-state devices and circuitries have unique material bodies having signal-translating regions attached thereto for active signal translation. These regions, comprising melt-grown, or simulated melt-grown, metallurgical compounds including oxides, eutectics, and intermetallics, are of controlled compositions, concentration profiles, and electronic or other optoelectromagnetic properties. In some devices, the microstructure of the compounds comprises a plurality of microscopically thin, regularly-shaped and uniformly-spaced bodies of one phase material dispersed in a matrix of another phase material. The electronic conductivity of the bodies is substantially different from that of the matrix, and the bodies all terminate at microscopic distance from the pn junction (or other interfacial rectifying barrier region), so as to confine the signal current carriers to flow mainly in only one of the phases. This achieves carriers microstreaming or microbranching effects. Described also herein are different devices including micron-size eutectic devices, dendritic devices, cellular devices, and granular devices; and their methods of manufacture. The barrier regions may be further modified by diffusion, ion implantation, selective oxidation, electrolytic etching, and surface-contouring. In addition, selected circuit elements may be embedded into these devices to achieve additional carriers movement control or to obtain special beneficial effects.
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