Low thermal expansion coefficient polyimides with improved elong

Details Low thermal expansion coefficient polyimides with improved elong Low thermal expansion coefficient polyimides with improved elong

1991-10-29

1993-11-09

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528125, 528128, 528172, 528173, 528174, 528176, 528183, 528185, 528188, 528190, 528191, 528220, 528229, 528350, 528353, 4284735, C08G 7310, C08G 6926, C08G 6300

Patent

active

052604080

ABSTRACT:
Polyimide compositions, films, and electronic devices using polyimides, based on 9,9-bis(perfluoroalkyl)xanthene-2,3,6,7-tetracarboxylic dianhydride or 9-aryl-9(perfluoroalkyl)xanthene-2,3,6,7-tetracarboxylic dianhydride and 3,3',4,4'-biphenyl tetracarboxylic dianhydride or 2,2-bis(3,4-carboxyphenyl)hexafluoropropane dianhydride and benzidine derivatives which offer a combination of desirable properties including, low linear coefficient of thermal expansion, low moisture absorption, high glass transition temperature, low dielectric constant, and improved tensile elongation.

REFERENCES:
patent: 5051520 (1991-09-01), Trofimenko
patent: 5097000 (1992-03-01), Trofimenko
patent: 5115090 (1992-05-01), Sachdev et al.
"Polyimides Derived from 2,2'-Bis(trifluoromethyl)-4,4'-diaminobiphenyl.1. Synthesis and Characterization of Polyimides Prepared with 2,2'-Bis(3,4-dicarboxyphenyl)hexafluoropropane Dianhydride or Pyromellitic Dianhydride," Matsuura, et al, Macromolecules, vol. 24, No. 18, 1991, pp. 5001-5005.

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