Printed circuit board with bi-metallic heat spreader

Details Printed circuit board with bi-metallic heat spreader Printed circuit board with bi-metallic heat spreader

1994-08-08

1995-11-21

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257712, 361720, H05K 720

Patent

active

054693292

ABSTRACT:
A printed wiring board adapted to mount electronic devices including one or more heat spreaders secured to the wiring board, the heat spreaders being formed of a material having high thermal conductivity, each heat spreader being adapted to support an electronic device which is bonded to the heat spreader, the portion of the heat spreader adjacent the electronic device having a metallic layer of low coefficient of thermal expansion that provides a localized area having a coefficient of thermal expansion that is approximately the same as that of the electronic device thereby tending to eliminate thermal stresses in the bond material used to attach the electronic device to the heat spreader, the relatively high thermally conductive material allowing thermal energy to be transferred effectively from the electronic device through the heat spreader to an adjacent heat sink.

REFERENCES:
patent: 4811166 (1989-03-01), Alvarez et al.
patent: 4907125 (1990-03-01), Drekmeier et al.
patent: 5272593 (1993-12-01), Jakob et al.

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