Thermoplastic film die attach adhesives

Compositions – Electrically conductive or emissive compositions – Free metal containing

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524439, H01B 106

Patent

active

049942077

ABSTRACT:
A die attach adhesive film having excellent die shear strength is provided by a polysiloxaneimide having a weight average molecular weight of at least 100,000 and a aromatic diamine segment with substituents in the meta position.

REFERENCES:
patent: 4395527 (1983-07-01), Berger
patent: 4519941 (1985-05-01), Anderson
patent: 4557860 (1985-12-01), DiSalvo et al.
patent: 4604230 (1986-08-01), Goswami et al.
patent: 4652398 (1987-03-01), Goswami et al.
patent: 4652598 (1987-03-01), Edelman

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