Protection and packaging system for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Patent

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Details

257684, 257701, 257710, 257704, H01L 2302

Patent

active

054122473

ABSTRACT:
A protection and packaging system for a semiconductor circuit having a first planar surface and an active region on at least a portion of the planar surface. An adhesive securely bonds a protective member directly to the first planar surface for generally protecting and hermetically sealing at least the active region of the semiconductor circuit. The protective member has a coefficient of thermal expansion which matches or closely matches that of the semiconductor device. The protective member may include an electrically conductive member and may have one or more openings. Individual electrically conductive members distribute power and ground to the active region of the circuit through bonding wires and contact pads located within the openings.

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