Semiconductor chip-supply method and apparatus

Details Semiconductor chip-supply method and apparatus Semiconductor chip-supply method and apparatus

1995-07-20

1996-12-31

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 437226, 294 641, B32B 3500

Patent

active

055890296

ABSTRACT:
A semiconductor chip-supply apparatus includes a sucking member, provided below an adhesive sheet, for sucking the adhesive sheet thereto, thus holding the adhesive sheet thereon. A semiconductor chip is bonded to an upper face of the adhesive sheet, which is positioned below the semiconductor chip. A push-up needle has a tip thereof positioned in a vicinity of a lower face of the adhesive sheet. A driving mechanism moves the sucking member and the adhesive sheet sucked thereto and held by the sucking member downward relatively to the push-up needle. A sucking collet for sucking and transporting the semiconductor chip separated from the adhesive sheet by a push-up operation of the push-up needle moves upward relatively to the sucking member and the adhesive sheet, the operation being caused by the downward movement of the sucking member and the adhesive sheet, which is caused by the driving mechanism.

REFERENCES:
patent: 4850780 (1989-07-01), Safabakhsh et al.
patent: 4859269 (1989-08-01), Nishiguchi
patent: 5348316 (1994-09-01), Lin

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