Passive gas substrate thermal conditioning apparatus and method

Details Passive gas substrate thermal conditioning apparatus and method Passive gas substrate thermal conditioning apparatus and method

1995-06-07

1996-12-31

Wolfe, Willis R.

Heating

Processes of heating or heater operation

Including preparing or arranging work for heating

432205, 432241, 432253, F27B 504, F27D 702, F27D 900

Patent

active

055888275

ABSTRACT:
A substrate thermal conditioning apparatus with a chamber, a plate located in the chamber and a gas supply. The plate has a top heat transfer surface with grooves therealong. A substrate is placed on standoffs of the heat transfer surface and gas is pumped into the chamber. The plate is either heated or cooled to change the temperature of the substrate. Heat is transferred between the substrate and the plate primarily by gas conduction heating. Because of the grooves in the plate, the gas can be very quickly and uniformly distributed and evacuated between the substrate and the heat transfer surface.

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