Lead frame, semiconductor device, and method of manufacturing sa

Details Lead frame, semiconductor device, and method of manufacturing sa Lead frame, semiconductor device, and method of manufacturing sa

1994-04-12

1995-05-02

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437215, 437219, 437220, H01L 2160

Patent

active

054119200

ABSTRACT:
A lead frame has a die pad with an array of surrounding leads connected at their sides by tie bars and at their ends by coupling bars which are connected through narrow supports to surrounding side rails or partition frames. Positioning holes are provided as positioning references in the coupling bars when the coupling parts of the leads such as the tie bars are removed to separate the leads from the lead frame.

REFERENCES:
patent: 4084312 (1978-04-01), Kirk et al.
patent: 4663650 (1987-05-01), Gilder, Jr. et al.
patent: 4870474 (1989-09-01), Karashima
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5206188 (1993-04-01), Hiroi et al.
patent: 5233738 (1993-06-01), Okada
patent: 5250470 (1993-10-01), Yamaguchi
patent: 5289032 (1994-02-01), Higgins, III et al.

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