Process for interconnecting conductive substrates using an inter

Details Process for interconnecting conductive substrates using an inter Process for interconnecting conductive substrates using an inter

1994-06-15

1995-11-21

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437216, 257698, 257737, H01L 2128, H01L 2158, H01L 21603

Patent

active

054686814

ABSTRACT:
A process for interconnecting conductive substrates using an interposer having conductive plastic filled vias. The process comprises the steps of forcing conductive plastic material through an end of the through holes in the interposer so that raised globs of the conductive plastic extend from an opposite end of the through holes. Then conductive pads of a first substrate are aligned and pressed against the raised globs such that the conductive plastic protrudes as bumps from the forcing ends of the through holes. Finally, conductive pads of a second substrate are aligned and pressed against the bumps.

REFERENCES:
patent: 4394712 (1983-07-01), Anthony
patent: 4712721 (1987-12-01), Noel et al.

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