Thin film delamination test chip

Details Thin film delamination test chip Thin film delamination test chip

1993-09-07

1995-11-21

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428901, 428615, 428620, B32B 900

Patent

active

054685419

ABSTRACT:
A delamination test chip comprises a semiconductor substrate and a plurality of layers stacked on the substrate. The delamination test chip is included in a die with one or more other chips. The die is packaged and subjected to environmental stress. The test chip includes an arrangement of conducting films and vias which enable the detection of a delamination and enable the identification of the particular layer at which the delamination occurs.

REFERENCES:
patent: 4988674 (1991-01-01), Mir et al.
Charles Hong, Thin Film Cracking/Delamination Evaluation Using Assembly Test Chip, 1992 WLR Final Report, pp. 163-166.

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