Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-09-05
1996-12-31
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29856, 264102, 264205, 437205, 437209, H05K 336
Patent
active
055882056
ABSTRACT:
The present invention includes a high density integrated circuit module which includes a plurality of stacked, individual integrated circuit devices wherein serpentine electrical interconnect rails connect electrical leads extending from the individual integrated circuit devices within the module.
REFERENCES:
patent: 3713893 (1973-01-01), Shirland
patent: 3746934 (1973-07-01), Stein
patent: 4103318 (1978-07-01), Schwede
patent: 4241493 (1980-12-01), Andrulitis et al.
patent: 4321418 (1982-03-01), Dran et al.
patent: 4437235 (1984-03-01), McIver
patent: 4521828 (1985-06-01), Fanning
patent: 4525921 (1985-07-01), Carson et al.
patent: 4763188 (1988-08-01), Johnson
patent: 4862249 (1989-08-01), Carlson
patent: 4878106 (1989-10-01), Sachs
patent: 4884237 (1989-11-01), Mueller et al.
patent: 4953005 (1990-08-01), Carlson et al.
patent: 4953060 (1990-08-01), Lauffer et al.
patent: 4956694 (1990-09-01), Eide
patent: 5016138 (1991-05-01), Woodman
patent: 5279029 (1984-01-01), Burns
patent: 5367766 (1994-11-01), Burns et al.
Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when the information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K.times.16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K.times.16 CMOS SRAM Module, pp. 865-870.
"High Density Memory Packaging Technology High Speed Imaging Applications," Dean Frew, Texas Instruments Inc., SPIE vol. 1346 Ultrahigh- and High-Speed Photography, Photonics, and Velocimetry '90, pp. 200-209.
"Vertically-Integrated Package," Abstract, Alvin Weinberg, W. Kinzy Jones, IEEE, pp. 436-443.
"3D Interconnection For Ultra-Dense Multichip Modules," Abstract, Christian VAL, IEEE, pp. 540-547.
Arbes Carl J.
Staktek Corporation
LandOfFree
Method of manufacturing a high density integrated circuit module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a high density integrated circuit module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a high density integrated circuit module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1133665