Method of efficiently laser marking singulated semiconductor dev

Details Method of efficiently laser marking singulated semiconductor dev Method of efficiently laser marking singulated semiconductor dev

1996-01-24

1999-08-10

Niebling, John F.

Semiconductor device manufacturing: process

With measuring or testing

2191218, M01L 2166

Patent

active

059372702

ABSTRACT:
A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.

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