Semiconductor device

Details Semiconductor device Semiconductor device

1988-11-21

1990-06-26

Davie, James W.

357 68, 357 72, H01L 2348

Patent

active

049376560

ABSTRACT:
A semiconductor device provided with a semiconductor chip having first and second surface facing in the opposite directions, electrodes on the first surface; a plurality of leads disposed parallel with each other along the second surface of the semiconductor chip and each having opposite ends respectively extending outward from opposite sides of the second surface; a wire electrically connecting one end of each lead and one of the electrodes of the semiconductor chip; a resin enclosing the semiconductor chip, the ends of the leads connected to the electrodes, and the wires. The leads extend across the second surface of the semiconductor chip so that a relatively long length each lead embedded in the resin and the wire bonding portions of the leads are located in the vicinity of the sides of the semiconductor chip, thereby improving the releability of the device and the ease of to wire bonding.

REFERENCES:
patent: 4595945 (1986-06-01), Graver
William Strauss et al., "Electronic Packaging Strategies for the 80s" by Integrated Circuit Engineering Corp. pp. 1B-7-1B-10 and 3F-9-3F24.

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