Method of making metal filled via holes in ceramic circuit board

Details Method of making metal filled via holes in ceramic circuit board Method of making metal filled via holes in ceramic circuit board

1977-07-21

1978-12-26

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 38B, 204 38S, 427 97, 428676, C25D 502, C25D 704

Patent

active

041315162

ABSTRACT:
A ceramic substrate is provided with via holes and these holes are primed by first depositing a palladium coating to the inside surface of the holes and then depositing an iron film onto the palladium. The primed holes are then completely filled with copper to provide conductive connections between opposite surfaces of the substrate. On one side of the substrate, input/output connector pins are brazed to the copper fillings. On the other side, printed circuitry is applied to produce a circuit module.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser et al.
patent: 2897409 (1959-07-01), Gitto
patent: 3099608 (1963-07-01), Radovsky et al.
IBM, TDB, vol. 8, No. 11, Apr. 1966, pp. 1494, 1495.
IBM, TDB, vol. 12, No. 1, Jun. 1969, p. 198.
IBM, TDB, vol. 12, No. 5, Oct. 1969, p. 719.
IBM, TDB, vol. 14, No. 9, Feb. 1972, pp. 2691-2692.
IBM, TDB, vol. 15, No. 8, Jan. 1973, p. 2492.
IBM, TDB, vol. 19, No. 3, Aug. 1976, p. 838.
Metal Finishing Guidebook Directory, 1969, p. 297.

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