Process for plating a long span of metal with a metal layer

Details Process for plating a long span of metal with a metal layer Process for plating a long span of metal with a metal layer

1983-04-18

1985-01-08

Williams, Howard S.

Chemistry: electrical and wave energy

Processes and products

204 33, 204 49, 204207, C25D 706, C25D 504, C25D 544

Patent

active

044926154

ABSTRACT:
A process for the continuous, electrolytic plating of a long span of metal with a layer of metal, having a high line speed and low period of immersion in the electrolyte, and a device therefor. The span of metal is passed through a shaving drawplate, then through a metal plating solution to which an electric voltage is applied through a fluid electric connector comprising a solution of metal chloride, a fluoride and boric acid.
The process is used to plate a metal with an adhesive metal layer, which provides both ductility to facilitate extrusion and low, non-evolving contact resistance.

REFERENCES:
patent: 3755116 (1973-08-01), Terai et al.
patent: 3766043 (1973-10-01), Herrmann et al.
patent: 3915667 (1975-10-01), Ricks
patent: 4097342 (1978-06-01), Cooke et al.
patent: 4128459 (1978-12-01), Bretts et al.
patent: 4169770 (1979-10-01), Cooke et al.

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