Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-12-19
1999-08-10
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361690, 361694, 361704, 361719, 361715, 257721, 257722, 257727, 165 802, 165 803, 16510434, H05K 720
Patent
active
059368365
ABSTRACT:
A computer in which a microprocessor module is disposed in the computer chassis and is cooled by a heat sink disposed in a heat exchange relation to the microprocessor. A fan is disposed in the chassis and adapted to induce air flow, and a shroud is connected to the heat sink and encloses the heat sink for directing the air through the heat sink for removing heat from the heat sink.
REFERENCES:
patent: 4710852 (1987-12-01), Keen
patent: 5331507 (1994-07-01), Kyung et al.
patent: 5452181 (1995-09-01), Hoover
patent: 5504650 (1996-04-01), Katsui et al.
patent: 5526874 (1996-06-01), White
patent: 5535094 (1996-07-01), Nelson et al.
patent: 5592363 (1997-01-01), Atarashi et al.
patent: 5625227 (1997-04-01), Estes et al.
patent: 5630469 (1997-05-01), Butterbaugh et al.
patent: 5640046 (1997-06-01), Suzuki et al.
patent: 5673176 (1997-09-01), Penniman et al.
U.S. Application No. 08/763,238, filed Dec. 12, 1996, Computer System With Heat Sink Having an Integrated Grounding Tab, Ralph Remsburg et al., Abstract and 3 sheets of drawings.
U.S. Application No. 08/959,185, filed Oct. 28, 1997, Heat Sink Fastener Retention Apparatus and Method for Computer Systems, John Jeffries et al., Abstract and 7 sheets of drawings.
U.S. Application No. 08/976,164, filed Nov. 21, 1997, Computer Processor Module Ground/EMI-Shield Spring Clip and Method, Rick Wahl et al., Abstract and 11 sheets of drawings.
Chervinsky Boris L.
Dell U.S.A. L.P.
Picard Leo P.
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