1984-08-08
1987-02-24
Edlow, Martin H.
357 71, 357 68, 357 80, 357 65, H01L 2702
Patent
active
046461264
ABSTRACT:
Disclosed is a semiconductor device in which IC chips, tested and evaluated as good, are mounted on a silicon substrate, and interconnection wiring layers and pads for IC chips are provided on the substrate with an insulation film interposed therebetween.
REFERENCES:
patent: 3255511 (1966-06-01), Weissenstern et al.
patent: 3619731 (1971-11-01), Baker et al.
patent: 3908187 (1975-09-01), Sheldon et al.
patent: 4017341 (1977-04-01), Suzuki et al.
patent: 4023197 (1977-05-01), Magdo et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4083063 (1978-04-01), Yu
patent: 4122479 (1978-10-01), Sugawara et al.
patent: 4143385 (1979-03-01), Miyoshi et al.
patent: 4199778 (1980-04-01), Masuhara et al.
patent: 4285001 (1981-08-01), Gerzberg et al.
patent: 4380114 (1983-04-01), Webb
Bodendorf et al., "Active Silicon Chip Carrier", IBM Tech. Disclosure Bulletin, vol. 15, No. 2, 7/72, pp. 656-657.
Sze, Physics of Semiconductor Devices, 2nd ed., John Wiley, NY, 1981, p. 493.
Edlow Martin H.
Kabushiki Kaisha Toshiba
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-112486