Method for making a raw board for use in printed circuits

Details Method for making a raw board for use in printed circuits Method for making a raw board for use in printed circuits

1978-03-15

1980-03-18

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 15, 204 20, C25D 502, C25D 556, C25D 706

Patent

active

041938496

ABSTRACT:
There is disclosed a method of making a raw board for use in printed circuits, comprising the steps of subjecting a film of a plastic to vapor deposition with a metal and then electrochemically depositing a metal on the metal.

REFERENCES:
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3901770 (1975-08-01), Littwin
Modern Electroplating Edited by Frederick A. Cowenheim, 1963, pp. 173-181.
Plating on Plastics, by Gerd Muller et al., 2nd Ed., (1971), pp. 22-37, 116-118.
Printed Circuit Techniques, NBS Circular 468, Issued Nov. 15, 1947, pp. 1-5, 9, 24-26.
Vacuum Deposition of Thin Films, by L. Holland, 5th Ed., (1963), pp. 44-47, 60, 358-367.

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