Plastic shield enclosure and method of producing the same

Details Plastic shield enclosure and method of producing the same Plastic shield enclosure and method of producing the same

1995-11-09

1999-02-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361814, 361816, 361818, 174 35R, H05K 714

Patent

active

058673709

ABSTRACT:
A conductive first enclosure section 11 is molded through a primary molding process. At this time, a primary mold is provided so as to form openings 13 and 14 in the first enclosure section 11 for portions that needs insulation (non-conductivity). At a secondary molding process to make a non-conductive second enclosure section 12, a secondary mold is provided so as to cover the first enclosure section 11 and then non-conductive resin is filled thereinto. The openings 13 and 14 in the first enclosure section 11 are filled with the non-conductive resin, thus the rear cover 1 is formed.

REFERENCES:
patent: 5045971 (1991-09-01), Ono et al.
patent: 5086509 (1992-02-01), Inubushi et al.
patent: 5150282 (1992-09-01), Tomura et al.
patent: 5596487 (1997-01-01), Castaneda et al.

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