Module mounting structure

Details Module mounting structure Module mounting structure

1997-04-21

1998-08-18

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361822, 361791, 361744, 361728, 361729, 361788, 361748, 439 65, 439 74, H05K 111, H01R 909

Patent

active

057965927

ABSTRACT:
In a module mounting structure, a plurality of lead frames are affixed to an affixing block of resin and then respectively soldered to a plurality of input/output pads provided on a daughter board. Subsequently, lugs protruding from both end portions of the affixing block are inserted in reference holes formed in the daughter board in order to prevent the block from being displaced. Input/output pads are provided on both sides of the daughter board, and electronic parts are mounted on both sides of the daughter board. The lead frames affixed to the affixing block are inserted in through holes formed in a mother board, and then soldered to the mother board. The structure is adaptive to an increase in the number of pins of the daughter board and an increase in module mounting density.

REFERENCES:
patent: 3790916 (1974-02-01), Keitel
patent: 5268819 (1993-12-01), Lonka

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