Electronic package using closed pore composites

Details Electronic package using closed pore composites Electronic package using closed pore composites

1991-05-14

1994-09-13

Turner, A. A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 4283133, 4283144, 4283191, 428432, 428433, 428469, 428472, 428698, 428701, 428704, 428901, C04B 3552, H05K 103

Patent

active

053467515

ABSTRACT:
The electronic packages of the invention all employ the general materials scheme of a low dielectric constant material (low K material) mounted on a dense, high thermal conductivity (high TC) ceramic base. In this way, the low K material provides the signal transmission paths to and from the I.C. chips housed in the package and thus allows for higher signal transmission speed. The high TC material allows for heat dissipation out of the package. The dense base and/or the low K material may contain metallization in any desired pattern. The low K material is preferably a composite of closed pores in a glass-containing matrix.

REFERENCES:
patent: 4134848 (1979-01-01), Adicoff et al.
patent: 4313026 (1982-01-01), Yamada et al.
patent: 4403107 (1983-09-01), Hoffman
patent: 4659611 (1987-04-01), Iwase et al.
patent: 4849380 (1989-07-01), Sawhill
patent: 4865875 (1989-09-01), Kellerman
patent: 4867935 (1989-09-01), Morrison, Jr.
patent: 5017434 (1991-05-01), Enloe et al.
patent: 5098781 (1992-03-01), Minnick et al.
Ceramic Source, vol. 8, 1992 (ACerS) p. TD 29.

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