Method for reducing seed deposition in electroless plating

Details Method for reducing seed deposition in electroless plating Method for reducing seed deposition in electroless plating

1998-03-23

1999-08-10

Talbot, Brian K.

Coating processes

With pretreatment of the base

Heating or drying pretreatment

427314, 427336, 427337, 4273855, 427 98, 427304, 4274431, B05D 302

Patent

active

059356529

ABSTRACT:
The present invention provides a novel method of reducing the amount of seed deposited on polymeric dielectric surfaces. The method comprises the following steps: providing a work-piece coated with a polymeric dielectric layer; baking the work-piece to modify the surface of the polymeric dielectric layer; then applying the seed to polymeric dielectric layer and electrolessly plating metal to the seed layer. The invention also relates to a circuit board produced by the method of the present invention.

REFERENCES:
patent: 4075260 (1978-02-01), Tsen et al.
patent: 4303715 (1981-12-01), Chang
patent: 4640718 (1987-02-01), Alnot et al.
patent: 4795660 (1989-01-01), Cooray et al.
patent: 4808431 (1989-02-01), Rickert
patent: 4969979 (1990-11-01), Appelt et al.
patent: 5178914 (1993-01-01), Goldblatt et al.
patent: 5183692 (1993-02-01), Mukerji et al.
patent: 5374344 (1994-12-01), Gall et al.
patent: 5443865 (1995-08-01), Tisdale et al.

Affiliated with

Also associated with

Rating

Method for reducing seed deposition in electroless plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for reducing seed deposition in electroless plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for reducing seed deposition in electroless plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1118055