Method of performing processes on features with electricity

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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205118, 205640, C25D 502

Patent

active

059354046

ABSTRACT:
A method of performing electrochemistry processes on features and connectors of a substrate includes the application of a shorting layer across the connectors which are in electrical contact with the features, thereby shorting the features and creating an assemblage for which electricity is applied.

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patent: 5342992 (1994-08-01), Noto
patent: 5516416 (1996-05-01), Canaperi et al.
Desai, et al., "Strippable Thin FIlm Circuit for Electroplating of Substrates", IBM Technical Disclosure Bulletin, V. 28, #9, Feb. 1986, pp. 3868-3869.
Burgess, et al., "General-Purpose Module Plating" IBM Technical Disclosure Bulletin, V. 32, #5B, Oct. 1989, pp. 448-449.

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