Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1996-10-16
1998-08-18
Jones, Deborah
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438715, 438725, 438727, 438734, 156345, C23F 102
Patent
active
057958319
ABSTRACT:
A method for removing a resist layer includes an RIE process and a downstream microwave process, each performed such that the temperature of the wafer is no greater than about 60.degree. C. By performing these processes cold, the resist need not be pre-heated to drive off solvents. The RIE process and the microwave process can be performed sequentially or simultaneously.
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Bersin Richard L.
Geng Quain
Masuda Yukio
Nakayama Izumi
Xu Han
Jones Deborah
Ulvac Technologies, Inc.
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