Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-07-29
1999-02-02
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156298, 1563031, 29844, 29884, H05K 310
Patent
active
058659340
ABSTRACT:
There is provided a method for arranging conductive bumps at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet being is in a plastic state or up to a temperature not lower than the grass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough. This permits positive connections with a high accuracy without forming a through-hole.
REFERENCES:
patent: 3079672 (1963-03-01), Bain, Jr. et al.
patent: 3488429 (1970-01-01), Boucher
patent: 3764436 (1973-10-01), Schmidt et al.
patent: 3835531 (1974-09-01), Luttmer
patent: 3881799 (1975-05-01), Elliott et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4763403 (1988-08-01), Klein et al.
patent: 4893404 (1990-01-01), Shirahata et al.
patent: 4967314 (1990-10-01), Higgins, III
patent: 5219639 (1993-06-01), Sugawara et al.
patent: 5245135 (1993-09-01), Schreiber et al.
patent: 5431571 (1995-07-01), Hanrahan et al.
patent: 5457881 (1995-10-01), Schmidt et al.
patent: 5474629 (1995-12-01), Yamazaki et al.
patent: 5527998 (1996-06-01), Anderson et al.
patent: 5601678 (1997-02-01), Gerber et al.
Arai Yasushi
Hamano Hiroshi
Motomura Tomohisa
Sato Yoshizumi
Yamamoto Yuichi
Kabushiki Kaisha Toshiba
Lorin Francis J.
LandOfFree
Method of manufacturing printed wiring boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing printed wiring boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing printed wiring boards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1113398