Planarization process using artificial gravity

Details Planarization process using artificial gravity Planarization process using artificial gravity

1997-11-20

1999-02-02

Powell, William

Coating apparatus

With means to centrifuge work

118636, B05C 1102

Patent

active

058658912

ABSTRACT:
The time needed to planarize the surface of an integrated circuit is reduced by causing the planarization liquid to settle in the presence of artificial gravity that supplements natural gravity. A number of different ways to achieve artificial gravity are described. These include centrifuging, magnetic repulsion, vertical pulling by a motor, and providing a pressure differential between the top and bottom sides of the wafer holder.

REFERENCES:
patent: 4806504 (1989-02-01), Cheeves
patent: 5211986 (1993-05-01), Ohkubo
patent: 5264246 (1993-11-01), Ikeno
patent: 5348615 (1994-09-01), Gupta
patent: 5716673 (1998-02-01), Yen et al.

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