Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-09-06
1997-08-19
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257678, 257713, 257796, 361707, 361715, 361719, 361720, H05K 720
Patent
active
056594585
ABSTRACT:
An integrated circuit chip package has a substrate having first and second mutually parallel sides and a preselected thickness and a space on the first side for the mounting thereon of an electronic component having a body with a flat surface. The substrate further includes a plurality of elongated thermal conductive members, each having a head portion adapted to be in contact with the flat surface of the electronic component. The members further have elongated body portions of a preselected length greater than the thickness of the substrate. The thermal conductive members extend through preselected holes in the substrate whereby heat may be conducted from the flat surface of the component through the thermal conductive member to the other side of the substrate.
REFERENCES:
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patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4924352 (1990-05-01), Septfons
patent: 5043845 (1991-08-01), McDermott et al.
patent: 5198887 (1993-03-01), Brown
patent: 5467251 (1995-11-01), Katchmar
Jensen Roger W.
Thompson Gregory D.
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