Wire bonding method

Details Wire bonding method Wire bonding method

1993-08-11

1995-02-07

Bradley, P. Austin

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281101, B23K 2010

Patent

active

053869362

ABSTRACT:
A wire bonding method used in a bonding apparatus manufacturing, for example, semiconductor devices makes a correction of the ultrasonic output of a transducer using one of three correction timing patterns: a first correction timing pattern which makes the ultrasonic output correction prior to a first bonding by a first bonding wire to a single IC device, a second correction timing pattern which makes the output correction prior to a first bonding by a bonding wire, and a third correction timing pattern which makes the output correction prior to a first bonding and prior to a second bonding. By selecting one of the three patterns, the ultrasonic oscillation output is corrected at an appropriate timing regardless of the differences in the characteristics of the transducers used.

REFERENCES:
patent: 5046654 (1991-09-01), Yamazaki et al.
patent: 5199630 (1993-04-01), Felber et al.

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