Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1982-05-24
1984-08-14
Godici, Nicholas P.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228180A, 228260, B23K 108, H05K 334
Patent
active
044652194
ABSTRACT:
Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered using first and second molten solder, successively. The first molten solder is forced to overflow from a nozzle member to form a wave of overflowing solder extending in the direction of the path of travel of the printed circuit board so that the lower side of the printed circuit board is brought into co-current contact with the upper surface of the solder wave for effecting both preheating and first soldering treatment by the first molten solder. A solder applicator is provided adjacent to and downstream of the nozzle member to effect a second soldering treatment by the second molten solder.
REFERENCES:
patent: 3151592 (1964-10-01), Wegener
patent: 3303983 (1967-02-01), Patrick
patent: 3565319 (1971-02-01), Eschenbrucher
patent: 4332342 (1982-06-01), van Der Put
Godici Nicholas P.
Hodak Marc
Nihon Den-Netsu Keiki Co. Ltd.
Yee Stephen F. K.
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