Moulding composition comprising a thermoset component and thermo

Details Moulding composition comprising a thermoset component and thermo Moulding composition comprising a thermoset component and thermo

1991-08-13

1994-11-15

Jagannathan, Vasu S.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525390, 525396, 525481, 525523, 525535, C08L 6110, C08L 6302, C08L 6304, C08L 8106

Patent

active

053649141

ABSTRACT:
A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60.degree. C., flowable under shear and self-adhesive at temperatures in the range 60.degree.-150.degree. C. and hardenable at temperature over 150.degree. C., said composition comprising an uncured or partly cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating units (Ph SO.sub.2 Ph).sub.n and Ph.sup.1.sub.a linked through ether and/or thioether, where Ph is paraphenylene, Ph.sup.1 is phenylene, n is 1 to 2 a is 1 to 3 and groups Ph.sup.1 are (when a exceeds 1) linked through a single chemical bond or a divalent group other than SO.sub.2 or alkylene or are fused together. Preferably the polyarylsulphone contains end-groups of formula --D--Y where D is a divalent aromatic hydrocarbon group and Y is a group reactive with the thermoset precursor and has been incipiently reacted with the thermoset precursor.

REFERENCES:
patent: 4108837 (1978-08-01), Johnson
patent: 4513077 (1985-04-01), Isobe et al.
patent: 4853442 (1989-08-01), Nguyen
patent: 4972031 (1990-11-01), Choate et al.
Stutz, Herbert et al.; Curable epoxy resin compositions useful for composites. Ger. Offen DE 3,523,318.
Sato, Tadahide et al., Matrix resin compositions for prepregs. Jpn Kokai Tokkyo Koho JP 61,250,021 [86,250,021].
Nakahara, Masanori et al.; Epoxy resin compositions for prepregs. Jpn. Kokai Tokkyo Koho JP 62 57,417 [87 57,417].
Helfand, David et al.; Epoxy resin/polysulfone molding compounds for cured products with excellent humidity and cracking resistence. Eur. Pat. Appl. Ep 151, 553.
Bucknall, C. B. et al.; Phase separation in crosslinked resins containing polymeric modifiers.; Polym. Eng. Sci. 1986, 26(1), 54-62 (Eng).
Hedrick, J. L. et al.; Chemical modification of matrix resin networks with engineering thermoplastics. III. Synthesis and properties of expoxy networks modified with amine terminates poly(aryl ether sulfone) oligomers.; Polym. Prepr (Am Chem. Soc., Div. Polym Chem.) 1985 26(2), 293-5.
Cecere, J. A. et al.; Morphology and properties of amine-terminated poly(arylene eti_her ketone)- and poly(arylene ether sulfone)- modified epoxy resin systems. Int SAMPE Symp. Exhib. 1986, 31 (Mater. Sci. Future), 580-8 (Eng.).

Affiliated with

Also associated with

Rating

Moulding composition comprising a thermoset component and thermo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Moulding composition comprising a thermoset component and thermo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Moulding composition comprising a thermoset component and thermo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1098337