Method for selectively controlling plating thicknesses

Details Method for selectively controlling plating thicknesses Method for selectively controlling plating thicknesses

1975-03-31

1976-06-08

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204DIG7, 204 27, C25D 502, C25D 700

Patent

active

039620476

ABSTRACT:
A method for selectively controlling the plating thickness on opposing sides of a body is disclosed. The method comprises providing an assembly of the body to be plated, a shield having apertures therein and a sealing member between body to be plated and the shield. The sealing member has an opening to allow plating solution to reach one surface of the body to be plated and has further openings to allow gases and depleted solution to escape from the assembly. The process provides a thinner layer of plated metal on the inner surface of the body to be plated and a thicker layer in the outer surface. It is particularly useful in plating ceramic circuit boards.

REFERENCES:
patent: 1519572 (1924-12-01), Wolf
patent: 1700178 (1929-01-01), Porzell
patent: 3743583 (1973-07-01), Castonguay

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