Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-12-26
1995-01-31
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 1562735, H04K 334
Patent
active
053849523
ABSTRACT:
A method of connecting an integrated circuit chip to a wiring substrate having a wiring pattern formed thereon. The method is intended to make a connection between fine connecting portions on the substrate and connecting pads on the chip easy and reliable. The connecting method includes connecting a plurality of connecting portions formed on a major surface of a wiring substrate to a plurality of connecting pads formed on a major surface of an integrated circuit chip through metal bumps and adhering portions of the major surface of the wiring substrate which have no connecting portions to portions of the major surface of the integrated circuit chip which have no connecting pads by means of a photothermosetting resin film selectively opened at the connecting portions.
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Jones, H. C., Long, D. T., "Plug and Socket Chip Joining," IBM Technical Disclosure Bulletin, vol. 26, No. 3A, Aug. 1983.
Arbes Carl J.
NEC Corporation
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