Thick bodied heat set molding

Details Thick bodied heat set molding Thick bodied heat set molding

1992-07-07

1994-11-15

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156245, 428 31, 264DIG60, B29C 4102

Patent

active

053644832

ABSTRACT:
A trim strip which has a thick body portion is formed with a fused outer perimeter. The central portion generally remains in a partially fused or incompletely fused state reducing cost while providing a trim strip with a pleasing aesthetic appearance.

REFERENCES:
patent: 2772194 (1956-11-01), Fisher et al.
patent: 2929778 (1961-04-01), Simons
patent: 2966469 (1960-12-01), Smythe et al.
patent: 3616099 (1971-10-01), Shanok et al.
patent: 3837984 (1974-09-01), Wagner et al.
patent: 3852389 (1974-12-01), Adler et al.
patent: 4101698 (1978-07-01), Dunning et al.
patent: 4260655 (1981-04-01), Zoller
patent: 4351868 (1982-09-01), Otani
patent: 4360549 (1982-11-01), Ozawa et al.
patent: 4369608 (1983-01-01), Miura et al.
patent: 4451518 (1984-05-01), Miura et al.
patent: 4498697 (1985-02-01), McGlone et al.
patent: 4515744 (1985-05-01), Stamper et al.
patent: 4563141 (1986-01-01), Zoller
patent: 4569880 (1986-02-01), Nishiyama et al.
patent: 4668543 (1987-05-01), Schlenz
patent: 4695501 (1987-09-01), Robinson
patent: 4800116 (1989-01-01), Ventimiglia et al.
patent: 4824617 (1989-04-01), Takeuchi et al.
patent: 4868021 (1989-09-01), Zoller
patent: 4911959 (1990-03-01), Miyakawa
patent: 5238622 (1993-08-01), Grimmer

Affiliated with

Also associated with

Rating

Thick bodied heat set molding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thick bodied heat set molding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick bodied heat set molding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1094606