Flip chip structure including a silicon semiconductor element bo

Details Flip chip structure including a silicon semiconductor element bo Flip chip structure including a silicon semiconductor element bo

1976-06-07

1977-02-01

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 59, 357 65, 357 68, 174 52S, 317101CC, H01L 3902, H01L 2904, H01L 2348, H01L 2940

Patent

active

T09550089

ABSTRACT:
A semiconductor device and carrier assembly package having a silicon integrated circuit semiconductor device provided with at least three raised electrical contacts on a first surface, a device support substrate of Si.sub.3 N.sub.4 provided with a conductive metallurgy pattern on at least one surface, the conductive pattern including an electrical contact configuration matching the raised electrical contacts on the device, metallurgical bonds between the raised electrical contacts on the device and the electrical contact pattern on the support substrate, and an electrically conductive means for electrically connecting elements of the conductive metallurgy pattern to coacting elements off the support substrate.

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