Wire-lead through hole interconnect device

Details Wire-lead through hole interconnect device Wire-lead through hole interconnect device

1993-10-26

1995-10-03

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

29837, 29842, 29845, 437180, 437203, 361807, 361809, 174260, 174262, 174263, H05K 118, B65D 7302

Patent

active

054557410

ABSTRACT:
An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.

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"Molded Circuits What Ever Happened to Molded 3D Circuitboards?" by Carl Kirkland, Plastics World/Feb., 1993 pp. 32-36.
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