Electronic device and integrated circuit

Details Electronic device and integrated circuit Electronic device and integrated circuit

1997-06-18

2000-09-19

Abraham, Fetsum

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257350, 257382, 257448, 257690, 257698, 257700, 257734, 257774, H01L 2348

Patent

active

061216836

ABSTRACT:
The present invention provides an integrated circuit structure in which an area necessary for making contact is assured in a multi-layered wiring structure even when a design rule is made rigorous. In a structure in which wires separated above and below by an interlayer insulating film are contacted, the wire at the lower layer is patterned into a pattern of the wire at the upper layer which are made to contact. Thereby, the present invention allows the area necessary for making the contact to be largely assured and to deal with the micronization.

REFERENCES:
patent: 5094965 (1992-03-01), Ozaki et al.
patent: 5625232 (1997-04-01), Numata et al.
patent: 5710462 (1998-01-01), Mizushima
patent: 5786616 (1998-07-01), Fukumoto et al.

Affiliated with

Also associated with

Rating

Electronic device and integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device and integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device and integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1076167