Structure for printed circuit design

Details Structure for printed circuit design Structure for printed circuit design

1998-03-10

2000-09-19

Lam, Cathy F.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257702, H01L 2348

Patent

active

061216798

ABSTRACT:
A substrate structure for surface mount devices includes: a plurality of substrate layers including at least a base layer and an outer layer; the base layer having a contact surface and a first array of conductive pads on the contact surface; the outer layer having a contact surface, a cutout and a second array of conductive pads on the contact surface; and the outer layer being mounted to the base layer with the cutout positioned over the first array, wherein the first array and the second array define in combination a device mounting site.

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