Method and process of contact to a heat softened solder ball arr

Details Method and process of contact to a heat softened solder ball arr Method and process of contact to a heat softened solder ball arr

1998-09-02

2000-09-19

Jeffery, John A.

Electric heating

Heating devices

Combined with diverse-type art device

219243, 219 851, 219 8522, 22818022, 228193, 324765, H01L 21603

Patent

active

061215767

ABSTRACT:
A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus, are disclosed.

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