Micromachining methods for making micromechanical moving structu

Details Micromachining methods for making micromechanical moving structu Micromachining methods for making micromechanical moving structu

1994-08-05

1995-10-03

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

1566431, 1566561, 216 17, 216 72, B44C 122, B29C 3700, C23F 100

Patent

active

054549043

ABSTRACT:
Micromachining methods for fabricating micromechanical structures which include plunger elements free to reciprocate within cavities are fabricated using processing steps in common with those employed in high density interconnect (HDI) technology for multi-chip module packaging. A polymer, such as a polyimide, is utilized as a micromachinable material. In one embodiment, cavities are formed in the polymer material by laser ablation, employing a sacrificial layer as a mask. Electroplated copper may be employed as a sacrificial release layer. One particular structure is a micromechanical electric switch including an array of individual switch contacts actuatable in common.

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R. B. Brown et al., "Characteristics of Molybdenum Thin Films for Micromechanical Structures", Proc. IEEE Microelectromechanical Systems, An Investigation of Microstructures, Sensors, Actuators, Machines and Robots, Napa Valley, Calif 11-14 Feb. 1990, pp. 77-81.

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