Detaping apparatus

Details Detaping apparatus Detaping apparatus

1994-08-10

1995-10-03

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156344, 221 25, 221 72, 221 82, 414405, 414411, B32B 3500

Patent

active

054549000

ABSTRACT:
An apparatus for removing both plastic leaded chip carrier and small outline package electronic components from carrier tapes includes a platform which supports the carrier tape and a drum which receives the cover tape which is peeled away from the carrier tape thereby releasing the electronic components. The electronic components slide under the influence of gravity along an adjustable guide into a collecting tube which has been clamped to the adjustable guide. The adjustable guide is capable of a position substantially perpendicular to the platform and a position substantially parallel to the platform thereby facilitating detaping of both plastic leaded chip carrier components and small outline package components.

REFERENCES:
patent: 4660282 (1987-04-01), Pfaff
patent: 4735341 (1988-04-01), Hamilton et al.
patent: 5268059 (1993-12-01), Olson
patent: 5299902 (1994-04-01), Fujiwara et al.

Affiliated with

Also associated with

Rating

Detaping apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Detaping apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Detaping apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1075186