High voltage termination with buried field-shaping region

Active solid-state devices (e.g. – transistors – solid-state diode – With specified shape of pn junction

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257927, H01L 2906

Patent

active

060112980

ABSTRACT:
A semiconductor device structure and method are presented for increasing a breakdown voltage of a junction between a substrate of first conductivity type and a device region. The structure includes a region of second conductivity type in the substrate completely buried in the substrate below and separated from the device region. The region of second conductivity type is located a predetermined distance away from the device region. The distance is sufficient to permit a depletion region to form between the region of second conductivity type and the device region, when a first voltage is applied between the device region and the substrate. The distance also is determined to produce a radius of curvature of the depletion region, when a second voltage that is larger than the first voltage is applied between the device region and the substrate, that is larger than a radius of curvature of the depletion region about the device region that would be formed if the region of second conductivity type were not present. Traditional field shaping regions spaced from the device region at a surface of the substrate and spaced from the region of second conductivity type may be used in conjunction with the buried ring, if desired.

REFERENCES:
patent: 4158206 (1979-06-01), Neilson
patent: 4374389 (1983-02-01), Temple
patent: 4630082 (1986-12-01), Sakai
patent: 5032878 (1991-07-01), Davies et al.
patent: 5218226 (1993-06-01), Slatter et al.
Patent Abstracts of Japan, vol. 007, No. 21 (E-155) Jan. 27, 1983.
Antognetti, Power Integrated Circuits: Physics, Design, and Applications, McGraw hill, 1986, pp. 3.1-3.58.
A. Blicher, Field-Effect and Bipolar Power Transistor Physics, Academic Press, pp. 53-84, 1981.

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