Resin-encapsulated semiconductor device having a particular moun

Details Resin-encapsulated semiconductor device having a particular moun Resin-encapsulated semiconductor device having a particular moun

1991-02-11

1992-09-22

Hille, Rolf

357 72, H01L 2312, H01L 2328

Patent

active

051501937

ABSTRACT:
The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.

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patent: 5021864 (1991-06-01), Keeley et al.
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